AMD 可能将进军 ARM 市场,推出基于台积电 3nm 工艺的声波 APU。
AMD could enter ARM market with Sound Wave APU built on TSMC 3nm process

原始链接: https://www.guru3d.com/story/amd-enters-arm-market-with-sound-wave-apu-built-on-tsmc-3nm-process/

AMD 正在进入 ARM 处理器市场,其名为“声波”的 APU 将超越其传统的 x86 架构。这款新芯片基于台积电的 3 纳米工艺制造,目标功耗范围为 5-10 瓦,直接与高通骁龙 X 精英版竞争。 “声波”采用独特的 2+4 混合核心设计,配备 4MB L3 缓存和 16MB MALL 缓存,旨在提高紧凑型设备的性能。它集成了 RDNA 3.5 图形处理器,包含四个计算单元,用于轻度游戏和机器学习,以及一个强大的 AI 引擎,用于设备端任务。 值得注意的是,该 APU 支持 128 位 LPDDR5X-9600 内存,预计将配备 16GB 板载内存。预计它将在 2026 年为未来的微软 Surface 产品提供动力,标志着 AMD 在不断增长的基于 ARM 的计算领域迈出了重要一步。生产计划于 2025 年底开始。

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原文
AMD is expanding its processor portfolio beyond the x86 architecture with its first ARM-based APU, internally known as “Sound Wave.” The chip’s existence was uncovered through customs import records, confirming several details about its design and purpose. Built with a BGA-1074 package measuring 32 mm × 27 mm, the processor fits within standard mobile SoC dimensions, making it suitable for thin and light computing platforms. It employs a 0.8 mm pitch and FF5 interface, replacing the FF3 socket previously used in Valve’s Steam handheld devices, further hinting at a new generation of compact AMD-powered hardware.

According to leaks from industry insiders such as @Moore’s Law Is Dead and @KeplerL2, “Sound Wave” is manufactured on TSMC’s 3 nm node and aims for a 5 W to 10 W TDP range, positioning it directly against Qualcomm’s Snapdragon X Elite. The chip is expected to power future Microsoft Surface products scheduled for release in 2026. “Sound Wave” reportedly adopts a 2 + 4 hybrid core design, consisting of two performance and four efficiency cores, paired with 4 MB of L3 cache and 16 MB of MALL cache, a memory technology inspired by the “Infinity Cache” used in AMD’s Radeon GPUs. This configuration is relatively uncommon in low-power APUs and aims to improve responsiveness and multitasking under constrained thermal conditions. On the graphics side, the processor integrates four RDNA 3.5 compute units, offering light gaming support and optimized machine learning acceleration.

Memory support is another highlight: the chip integrates a 128-bit LPDDR5X-9600 controller and will reportedly include 16 GB of onboard RAM, aligning with current trends in unified memory designs used in ARM SoCs. Additionally, the APU carries AMD’s fourth-generation AI engine, enabling on-device inference tasks and enhanced efficiency for workloads such as speech recognition, image analysis, and real-time translation.

While AMD experimented with ARM over a decade ago through the abandoned “Project Skybridge,” this new effort represents a more mature and strategic approach. With industry interest in efficient, ARM-based computing accelerating, “Sound Wave” could help AMD diversify its portfolio while leveraging its strengths in graphics and AI acceleration. If reports are accurate, the processor will enter production in late 2025, with commercial devices expected the following year.

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Source: ithome

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