According to leaks from industry insiders such as @Moore’s Law Is Dead and @KeplerL2, “Sound Wave” is manufactured on TSMC’s 3 nm node and aims for a 5 W to 10 W TDP range, positioning it directly against Qualcomm’s Snapdragon X Elite. The chip is expected to power future Microsoft Surface products scheduled for release in 2026. “Sound Wave” reportedly adopts a 2 + 4 hybrid core design, consisting of two performance and four efficiency cores, paired with 4 MB of L3 cache and 16 MB of MALL cache, a memory technology inspired by the “Infinity Cache” used in AMD’s Radeon GPUs. This configuration is relatively uncommon in low-power APUs and aims to improve responsiveness and multitasking under constrained thermal conditions. On the graphics side, the processor integrates four RDNA 3.5 compute units, offering light gaming support and optimized machine learning acceleration.
Memory support is another highlight: the chip integrates a 128-bit LPDDR5X-9600 controller and will reportedly include 16 GB of onboard RAM, aligning with current trends in unified memory designs used in ARM SoCs. Additionally, the APU carries AMD’s fourth-generation AI engine, enabling on-device inference tasks and enhanced efficiency for workloads such as speech recognition, image analysis, and real-time translation.
While AMD experimented with ARM over a decade ago through the abandoned “Project Skybridge,” this new effort represents a more mature and strategic approach. With industry interest in efficient, ARM-based computing accelerating, “Sound Wave” could help AMD diversify its portfolio while leveraging its strengths in graphics and AI acceleration. If reports are accurate, the processor will enter production in late 2025, with commercial devices expected the following year.
Source: ithome