华为宣称芯片技术突破打破制裁,中芯国际股价大涨
Huawei Touts Sanctions-Busting Chip Breakthrough, SMIC Shares Erupt

原始链接: https://www.zerohedge.com/technology/huawei-touts-sanctions-busting-chip-breakthrough-smic-shares-erupt

中芯国际股价飙升,此前华为发布了一项旨在摆脱对西方技术依赖的芯片生产战略。在 IEEE ISCAS 会议上,华为半导体部门负责人何庭波提出了“Tau (τ) 缩放定律”,这是一项优先考虑时间缩放和信号传输延迟优化,而非传统几何尺寸缩放的新原则。 通过采用名为“LogicFolding”的专有架构,华为旨在提高晶体管密度和性能。该公司计划在 2031 年前实现 1.4 纳米芯片的生产。尽管这一时间表较行业领导者台积电落后约五年,但这一突破被视为中国在绕过美国出口管制并减少对西方设备依赖方面迈出的重要一步。 这一消息引发了中国芯片股的集体上涨,中芯国际股价涨幅超过 18%。随着全球在先进半导体制造领域的地缘政治竞争加剧,这一进展预计将引起美国官员的密切关注。

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原文

Semiconductor Manufacturing International soared to a record high in China after Huawei unveiled what it described as a breakthrough pathway for advanced semiconductor production at the IEEE ISCAS conference, without relying on the West's most advanced chipmaking equipment.

Huawei's semiconductor chief, He Tingbo, told the audience earlier today that the company has developed a "New Semiconductor Path in Practice" that replaces traditional Moore's Law-style geometric scaling with time scaling and reducing signal propagation delay across devices, circuits, chips, and systems.

Huawei's press release stated:

In her speech, she presented the Tau (τ) Scaling Law, a new principle for guiding the future development of the semiconductor industry. This law proposes replacing geometric scaling with time (τ) scaling as a new guiding principle for the evolution of both semiconductors and electronic systems. Based on this principle, innovative technologies such as LogicFolding can be used to continuously compress signal propagation delay and steadily improve transistor density, which will drive the ongoing evolution of semiconductors and electronic systems.

Tingbo said Huawei plans to make 1.4-nanometer chips by 2031 using its own "LogicFolding" architecture. TSMC has said it expects to begin mass production of 1.4nm chips in 2028, leaving Huawei about five years behind the global leader, Taiwan Semiconductor Manufacturing.

Tingbo claims LogicFolding can boost chip performance and will be used in upcoming Kirin mobile chips expected this fall.

This comes as U.S. sanctions on advanced chipmaking equipment and high-end semiconductors have been aimed at slowing China's push into cutting-edge chip production.

Shares of Chinese chip stocks surged, with SMIC jumping more than 18% and Hua Hong Semiconductor hitting daily limits.

The view is that this is a potential breakthrough in China's effort to bypass U.S.-led export controls and reduce dependence on Western semiconductor equipment.

We suspect someone in the Trump team will likely weigh in on this development in the coming days, if not weeks.

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